Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972601 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2018-05-15 |
| 9859255 | Electronic device package | Jh Yoon, Yong She, Mao Guo | 2018-01-02 |