Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972601 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2018-05-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972601 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2018-05-15 |