Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163845 | Method and apparatus for measuring a free air ball size during wire bonding | Keng Yew SONG, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan | 2018-12-25 |
| 10078531 | Predictively provisioning cloud computing resources for virtual machines | Zhong Feng, Jiang Li, Chao Yu, Qing Feng Zhang | 2018-09-18 |
| 9889521 | Method and system for pull testing of wire bonds | Keng Yew SONG, Qing Le Tan, Lin Zheng, Jia Le Luo | 2018-02-13 |