Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163845 | Method and apparatus for measuring a free air ball size during wire bonding | Yi Bin Wang, Zuo Cheng Shen, Jia Le Luo, Qing Le Tan | 2018-12-25 |
| 9889521 | Method and system for pull testing of wire bonds | Yi Bin Wang, Qing Le Tan, Lin Zheng, Jia Le Luo | 2018-02-13 |
| 9881891 | Method of forming three-dimensional wire loops and wire loops formed using the method | Jeffrey Grijaldo, Jung Min Kim, Joon Ho Lee, Chi Kwan Park | 2018-01-30 |