Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163845 | Method and apparatus for measuring a free air ball size during wire bonding | Keng Yew SONG, Yi Bin Wang, Zuo Cheng Shen, Qing Le Tan | 2018-12-25 |
| 9889521 | Method and system for pull testing of wire bonds | Keng Yew SONG, Yi Bin Wang, Qing Le Tan, Lin Zheng | 2018-02-13 |