Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10162325 | Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies | Mark A. Burns, Douglas S. Dewey, Daniel Reinhardt | 2018-12-25 |
| 10089161 | System and method for managing semiconductor manufacturing defects | Jeanne P. Bickford, Baozhen Li, Pascal A. Nsame | 2018-10-02 |
| 10067184 | Product performance test binning | Theodoros E. Anemikos, Jeanne P. Bickford, Susan K. Lichtensteiger | 2018-09-04 |
| 9940430 | Burn-in power performance optimization | Jeanne P. Bickford, Baozhen Li, Tad J. Wilder | 2018-04-10 |
| 9891275 | Integrated circuit chip reliability qualification using a sample-specific expected fail rate | Jeanne P. Bickford, Baozhen Li, Tad J. Wilder | 2018-02-13 |
| 9880892 | System and method for managing semiconductor manufacturing defects | Jeanne P. Bickford, Baozhen Li, Pascal A. Nsame | 2018-01-30 |