Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156512 | System and method for measuring thermal reliability of multi-chip modules | Qian Han, Junsheng Guo | 2018-12-18 |
| 10103087 | Heat dissipation assembly and electronic device | Linfang Jin, Guoping Wang, Jie Zou, Hualin Li | 2018-10-16 |