Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156512 | System and method for measuring thermal reliability of multi-chip modules | Qian Han, Yongwang Xiao | 2018-12-18 |
| 9967987 | Electronic device enclosure and electronic device | Lue Sun | 2018-05-08 |