Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156512 | System and method for measuring thermal reliability of multi-chip modules | Junsheng Guo, Yongwang Xiao | 2018-12-18 |
| 9928767 | System and method for testing chip-on-glass bonding quality | Xiangan Zhu, Guoping Luo, Shunlin Chen, Guangrong Wu, Jose A. Garcia +2 more | 2018-03-27 |