Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot +3 more | 2018-12-18 |
| 10153162 | Shrink process aware assist features | Ryan Ryoung-Han Kim, Azat Latypov, Tamer Coskun, Lei Sun | 2018-12-11 |
| 10147714 | Method, apparatus, and system for two-dimensional power rail to enable scaling of a standard cell | Yan Wang, Jia Zeng, Chenchen Jacob Wang, Lei Yuan, Jongwook Kye | 2018-12-04 |
| 10014297 | Methods of forming integrated circuit structure using extreme ultraviolet photolithography technique and related integrated circuit structure | Lei Sun, Xunyuan Zhang, Ruilong Xie, Jia Zeng, Xuelian Zhu +2 more | 2018-07-03 |