Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163633 | Non-mandrel cut formation | Xunyuan Zhang, Errol Todd Ryan, Nicholas V. LiCausi | 2018-12-25 |
| 10109526 | Etch profile control during skip via formation | Xunyuan Zhang, Nicholas V. LiCausi, J. Jay McMahon, Ryan Smith, Errol Todd Ryan | 2018-10-23 |
| 10056291 | Post spacer self-aligned cuts | Xunyuan Zhang, Frank W. Mont, Genevieve Beique, Lei Sun | 2018-08-21 |
| 10056292 | Self-aligned lithographic patterning | Genevieve Beique, Frank W. Mont, Lei Sun, Xunyuan Zhang | 2018-08-21 |
| 10026687 | Metal interconnects for super (skip) via integration | Sean Xuan Lin, Xunyuan Zhang, James Jay McMahon | 2018-07-17 |
| 10014297 | Methods of forming integrated circuit structure using extreme ultraviolet photolithography technique and related integrated circuit structure | Lei Sun, Wenhui Wang, Xunyuan Zhang, Ruilong Xie, Jia Zeng +2 more | 2018-07-03 |
| 9966338 | Pre-spacer self-aligned cut formation | Xunyuan Zhang | 2018-05-08 |
| 9905424 | Self-aligned non-mandrel cut formation for tone inversion | — | 2018-02-27 |