Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134580 | Metallization levels and methods of making thereof | Nicholas V. LiCausi, Errol Todd Ryan | 2018-11-20 |
| 10109490 | Cobalt interconnects formed by selective bottom-up fill | Xunyuan Zhang | 2018-10-23 |
| 10103029 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr. +2 more | 2018-10-16 |
| 10026687 | Metal interconnects for super (skip) via integration | Xunyuan Zhang, Shao Beng Law, James Jay McMahon | 2018-07-17 |