{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2018", "item": "https://www.patentleaderboard.com/2018/"}, {"@type": "ListItem", "position": 3, "name": "Macdermid Enthone", "item": "https://www.patentleaderboard.com/2018/company/macdermid-enthone"}, {"@type": "ListItem", "position": 4, "name": "Chen Wang", "item": "https://www.patentleaderboard.com/2018/inventor/fl:ch_ln:wang-935"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
CW

Chen Wang — 1 Patent in 2018

MEMacdermid Enthone: 1 patents #1 of 9Top 15%
New Haven, CT: #23 of 114 inventorsTop 25%
Connecticut: #1,388 of 3,763 inventorsTop 40%
Overall (2018): #454,155 of 503,207Top 95%
1 Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10103029 Process for filling vias in the microelectronics Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Vincent Paneccasio, Jr., Cai Wang +2 more 2018-10-16