Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163681 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Klaus Martinschitz, Bernhard Rebhan, Kurt Hingerl | 2018-12-25 |
| 10109538 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack | — | 2018-10-23 |
| 10083854 | Method and device for surface treatment of substrates | — | 2018-09-25 |
| 10083933 | Method for permanent bonding of wafers | Thomas Plach, Kurt Hingerl, Christoph Flotgen | 2018-09-25 |
| 10008424 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack | — | 2018-06-26 |
| 9947638 | Device and method for permanent bonding | Bernhard Rebhan | 2018-04-17 |
| 9911713 | Method for applying a bonding layer | — | 2018-03-06 |
| 9899223 | Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substrates | Viorel Dragoi, Christoph Flotgen | 2018-02-20 |