Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163681 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Markus Wimplinger, Bernhard Rebhan, Kurt Hingerl | 2018-12-25 |