Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163681 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Klaus Martinschitz, Markus Wimplinger, Kurt Hingerl | 2018-12-25 |
| 9947638 | Device and method for permanent bonding | Markus Wimplinger | 2018-04-17 |