Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147853 | Encapsulant with index matched thixotropic agent | Bernd Keller | 2018-12-04 |
| 9954144 | Wafer level contact pad solder bumping for surface mount devices with non-planar recessed contacting surfaces | Chandan Bhat | 2018-04-24 |
| 9865780 | LED package with encapsulant having planar surfaces | Eric Tarsa, Sten Heikman, Bernd Keller, Jesse Colin Reiherzer, Hormoz Benjamin | 2018-01-09 |