Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10164158 | Molded chip fabrication method and apparatus | Michael Leung, James Ibbetson | 2018-12-25 | |
| 9869432 | Luminaires using waveguide bodies and optical elements | Bernd Keller, Zongjie Yuan | 2018-01-16 | $6,022,000 |
| 9865780 | LED package with encapsulant having planar surfaces | Theodore Lowes, Sten Heikman, Bernd Keller, Jesse Colin Reiherzer, Hormoz Benjamin | 2018-01-09 | $9,658,000 |