Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9954144 | Wafer level contact pad solder bumping for surface mount devices with non-planar recessed contacting surfaces | Theodore Lowes | 2018-04-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9954144 | Wafer level contact pad solder bumping for surface mount devices with non-planar recessed contacting surfaces | Theodore Lowes | 2018-04-24 |