HP

Heng Pan

Applied Materials: 1 patents #421 of 1,019Top 45%
Overall (2018): #400,723 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
9909925 Apparatus and method to measure temperature of 3D semiconductor structures via laser diffraction Matthew S. Rogers, Aaron Muir Hunter, Stephen Moffatt 2018-03-06