Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704829 | Stacked structure of semiconductor chips having via holes and metal bumps | Chih-Hsien Lin | 2017-07-11 |
| 9673186 | Semiconductor integrated circuit | Shinichiro Takatani, Hsien-Fu Hsiao, Cheng-Kuo Lin | 2017-06-06 |
| 9548276 | Structure of backside copper metallization for semiconductor devices and a fabrication method thereof | Jason Chen, Wen Chu | 2017-01-17 |