Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704829 | Stacked structure of semiconductor chips having via holes and metal bumps | Chang-Hwang Hua | 2017-07-11 |
| 9689914 | Method of testing a three-dimensional integrated circuit | Ching-Fang Chen, Hsiang-Tai Lu | 2017-06-27 |
| 9607999 | System and method of UV programming of non-volatile semiconductor memory | Hsiang-Tai Lu | 2017-03-28 |
| 9590595 | Driver circuit with feed-forward equalizer | Yan Luo, Chien-Hua Wu, Chung-Shi Lin | 2017-03-07 |
| 9590610 | Driver circuit for signal transmission and control method of driver circuit | Yan Luo, Chien-Hua Wu, Chung-Shi Lin | 2017-03-07 |