Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548276 | Structure of backside copper metallization for semiconductor devices and a fabrication method thereof | Chang-Hwang Hua, Wen Chu | 2017-01-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548276 | Structure of backside copper metallization for semiconductor devices and a fabrication method thereof | Chang-Hwang Hua, Wen Chu | 2017-01-17 |