Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711454 | Through via structure for step coverage improvement | Li-Yen Fang, Jung-Chih Tsao, Yao-Hsiang Liang | 2017-07-18 |
| 9601535 | Semiconducator image sensor having color filters formed over a high-K dielectric grid | Shiu-Ko Jang Jian, Chih-Nan Wu, Chun Che Lin | 2017-03-21 |