Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711454 | Through via structure for step coverage improvement | Li-Yen Fang, Jung-Chih Tsao, Yu-Ku Lin | 2017-07-18 |
| 9691804 | Image sensing device and manufacturing method thereof | Chih-Chang Huang, Chi-Ming Lu, Jian Chen, Jung-Chih Tsao | 2017-06-27 |
| 9666545 | Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same | Hung-Chih Wang | 2017-05-30 |