Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711454 | Through via structure for step coverage improvement | Jung-Chih Tsao, Yao-Hsiang Liang, Yu-Ku Lin | 2017-07-18 |
LF
Li-Yen Fang
Overall (2017): #334,259 of 506,227Top 70%
1
Patents 2017