Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847269 | Fan-out packages and methods of forming same | Jing-Cheng Lin, Jeffrey Chang, Chun-Hsing Su, Yi-Chao Mao | 2017-12-19 |
| 9741693 | Semiconductor package and method of forming the same | Chin-Fu Kao, Jing-Cheng Lin | 2017-08-22 |
| 9633924 | Package structure and method for forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2017-04-25 |