Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847269 | Fan-out packages and methods of forming same | Jing-Cheng Lin, Jeffrey Chang, Chun-Hsing Su, Tsei-Chung Fu | 2017-12-19 |
| 9698121 | Methods and structures for packaging semiconductor dies | Jing-Cheng Lin | 2017-07-04 |