Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9658275 | De-embedding on-wafer devices | Hsiao-Tsung Yen, Chin-Wei Kuo, Ho-Hsiang Chen, Yu-Ling Lin | 2017-05-23 |
| 9548267 | Three dimensional circuit including shielded inductor and method of forming same | Ming-Hsien Tsai, Hsieh-Hung Hsieh, Tzu-Jin Yeh, Chewn-Pu Jou, Fu-Lung Hsueh | 2017-01-17 |