Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583366 | Thermally-enhanced provision of underfill to electronic devices using a stencil | Qinglong Zhang, John Hon-Shing Lau, Michael Zahn, Yiu Ming Cheung | 2017-02-28 |
| 9536987 | Line-end cutting method for fin structures of FinFETs formed by double patterning technology | Chunyan Yi | 2017-01-03 |