Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583366 | Thermally-enhanced provision of underfill to electronic devices using a stencil | Qinglong Zhang, John Hon-Shing Lau, Ming-Yang Li, Yiu Ming Cheung | 2017-02-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583366 | Thermally-enhanced provision of underfill to electronic devices using a stencil | Qinglong Zhang, John Hon-Shing Lau, Ming-Yang Li, Yiu Ming Cheung | 2017-02-28 |