Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847294 | Semiconductor device allowing metal layer routing formed directly under metal pad | Chun-Liang Chen, Tien-Chang Chang | 2017-12-19 |
| 9780213 | Semiconductor device having a reversed T-shaped profile in the metal gate line-end | Chien-Hung Yeh, Guan-Jie Shen, Chia-Der Chang | 2017-10-03 |
| 9669469 | Coupling device of jig | — | 2017-06-06 |
| 9627336 | Semiconductor device allowing metal layer routing formed directly under metal pad | Chun-Liang Chen, Tien-Chang Chang | 2017-04-18 |