Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847294 | Semiconductor device allowing metal layer routing formed directly under metal pad | Chun-Liang Chen, Chien-Chih Lin | 2017-12-19 |
| 9627336 | Semiconductor device allowing metal layer routing formed directly under metal pad | Chun-Liang Chen, Chien-Chih Lin | 2017-04-18 |