| 9852242 |
Atomic scale grid for modeling semiconductor structures and fabrication processes |
Stephen Lee Smith |
2017-12-26 |
| 9836563 |
Iterative simulation with DFT and non-DFT |
Jie Liu, Michael C. Shaughnessy-Culver, Stephen Lee Smith, Yong-Seog Oh, Pratheep Balasingam +1 more |
2017-12-05 |
| 9817928 |
Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits |
Jamil Kawa |
2017-11-14 |
| 9786734 |
Integrated circuit devices having features with reduced edge curvature and methods for manufacturing the same |
Lars Bomholt |
2017-10-10 |
| 9735227 |
2D material super capacitors |
Jamil Kawa |
2017-08-15 |
| 9728528 |
Method and apparatus for floating or applying voltage to a well of an integrated circuit |
Jamil Kawa, James David Sproch, Robert B. Lefferts |
2017-08-08 |
| 9727675 |
Parameter extraction of DFT |
Jie Liu, Michael C. Shaughnessy-Culver, Stephen Lee Smith, Yong-Seog Oh, Pratheep Balasingam +1 more |
2017-08-08 |
| 9691768 |
Nanowire or 2D material strips interconnects in an integrated circuit cell |
Jamil Kawa |
2017-06-27 |
| 9691764 |
FinFET cell architecture with power traces |
Jamil Kawa, Deepak D. Sherlekar |
2017-06-27 |
| 9646966 |
N-channel and P-channel end-to-end finFET cell architecture |
— |
2017-05-09 |
| 9547740 |
Methods for fabricating high-density integrated circuit devices |
Xi-Wei Lin |
2017-01-17 |