Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754860 | Redistribution layer contacting first wafer through second wafer | Michael A. Stuber, Mark Drucker | 2017-09-05 |
| 9748272 | Semiconductor-on-insulator with back side strain inducing material | Paul A. Nygaard, Michael A. Stuber | 2017-08-29 |
| 9673219 | Vertical semiconductor device with thinned substrate | Michael A. Stuber | 2017-06-06 |
| 9576937 | Back-to-back stacked integrated circuit assembly | Michael A. Stuber | 2017-02-21 |
| 9570558 | Trap rich layer for semiconductor devices | Christopher N. Brindle, Michael A. Stuber | 2017-02-14 |