Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754860 | Redistribution layer contacting first wafer through second wafer | Stuart B. Molin, Michael A. Stuber | 2017-09-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754860 | Redistribution layer contacting first wafer through second wafer | Stuart B. Molin, Michael A. Stuber | 2017-09-05 |