Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653335 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Michihiro Sugo | 2017-05-16 |
| 9646868 | Wafer temporary bonding method and thin wafer manufacturing method | Hiroyuki Yasuda, Michihiro Sugo, Masahito Tanabe | 2017-05-09 |