Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9796892 | Silicone adhesive composition and solid-state imaging device | Hiroyuki Yasuda, Kyoko Soga | 2017-10-24 |
| 9653335 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Shohei Tagami | 2017-05-16 |
| 9646868 | Wafer temporary bonding method and thin wafer manufacturing method | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2017-05-09 |
| 9550931 | Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same | Hiroyuki Yasuda | 2017-01-24 |