Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9650538 | Method for manufacturing micro-structure | Hiroshi Kanbara, Tomoyoshi Furihata, Yoshinori Hirano | 2017-05-16 |
| 9653335 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Michihiro Sugo, Shohei Tagami | 2017-05-16 |