Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799591 | Semiconductor packages including thermal blocks | Seung-Yong Cha, Keung Beum Kim, HyunJong Moon, Heeseok Lee | 2017-10-24 |
| 9666517 | Semiconductor packages with a substrate between a pair of substrates | — | 2017-05-30 |
| 9659852 | Semiconductor package | Tongsuk Kim, HyunJong Moon, Tai-Hyun Eum, Heeseok Lee, Keung Beum Kim +2 more | 2017-05-23 |
| 9560767 | Wiring boards and semiconductor modules including the same | Seung Hwan Kim, Heeseok Lee | 2017-01-31 |