Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9830973 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Seung-Yong Cha | 2017-11-28 |
| 9799591 | Semiconductor packages including thermal blocks | Seung-Yong Cha, Keung Beum Kim, Yonghoon Kim, HyunJong Moon | 2017-10-24 |
| 9721644 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Seung-Yong Cha | 2017-08-01 |
| 9659852 | Semiconductor package | Tongsuk Kim, HyunJong Moon, Tai-Hyun Eum, Keung Beum Kim, Yonghoon Kim +2 more | 2017-05-23 |
| 9560767 | Wiring boards and semiconductor modules including the same | Yonghoon Kim, Seung Hwan Kim | 2017-01-31 |