Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9830973 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Heeseok Lee | 2017-11-28 |
| 9799591 | Semiconductor packages including thermal blocks | Keung Beum Kim, Yonghoon Kim, HyunJong Moon, Heeseok Lee | 2017-10-24 |
| 9721644 | Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure | Keung Beum Kim, HyunJong Moon, Heeseok Lee | 2017-08-01 |
| 9659852 | Semiconductor package | Tongsuk Kim, HyunJong Moon, Tai-Hyun Eum, Heeseok Lee, Keung Beum Kim +2 more | 2017-05-23 |