Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691637 | Method for packaging an integrated circuit device with stress buffer | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2017-06-27 |
| 9559077 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Rama I. Hegde | 2017-01-31 |