Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9590063 | Method and structure for a large-grain high-K dielectric | — | 2017-03-07 |
| 9559077 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Nishant Lakhera | 2017-01-31 |