Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691637 | Method for packaging an integrated circuit device with stress buffer | Navas Khan Oratti Kalandar, Nishant Lakhera | 2017-06-27 |
| 9598280 | Environmental sensor structure | Dwight L. Daniels, Darrel R. Frear, Stephen R. Hooper | 2017-03-21 |
| 9559077 | Die attachment for packaged semiconductor device | Rama I. Hegde, Nishant Lakhera | 2017-01-31 |