Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842776 | Integrated circuits and molding approaches therefor | John Suman Nakka, Roelf Anco Jacob Groenhuis | 2017-12-12 |
| 9798228 | Maximizing potential good die per wafer, PGDW | Hans Cobussen, Heimo Scheucher, Laurentius de Kok | 2017-10-24 |
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2017-07-11 |