Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2017-07-11 |
| 9653414 | Shielded QFN package and method of making | Jan Gulpen | 2017-05-16 |