Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2017-07-11 |