Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9723766 | Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides | Jian Yin, Michael Althar | 2017-08-01 |
| 9717146 | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same | Jian Yin, Loyde M. Carpenter, Jr., Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet +1 more | 2017-07-25 |
| 9613889 | Packaged circuit with a lead frame and laminate substrate | Jian Yin, Loyde M. Carpenter, Jr. | 2017-04-04 |
| 9607917 | Stacked inductor-electronic package assembly and technique for manufacturing same | Zaki Moussaoui | 2017-03-28 |