Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9717146 | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same | Jian Yin, Nikhil Vishwanath Kelkar, Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet +1 more | 2017-07-25 |
| 9627297 | Solder flow-impeding plug on a lead frame | Randolph Cruz | 2017-04-18 |
| 9613889 | Packaged circuit with a lead frame and laminate substrate | Jian Yin, Nikhil Vishwanath Kelkar | 2017-04-04 |
| 9536852 | Lead frame having a perimeter recess within periphery of component terminal | Randolph Cruz | 2017-01-03 |